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ICT - INFORMATION AND COMMUNICATION TECHNOLOGIES

A Theme for research and development under the specific programme “Cooperation”
implementing the Seventh Framework Programme (2007-2013) of the European
Community for research, technological development and demonstration activities

3.3 Challenge 3: Components, systems, engineering

The share of electronic components in the value of engineered products and their impact in terms of added functionality and cost-efficiency is expected to reach unprecedented levels over the next few years. Europe has major strengths in the supply of hardware and software components and their integration and deployment into intelligent systems, from portable devices to cars, airplanes, health systems and manufacturing plants.

The challenge is to strengthen Europe’s position as a leading supplier of electronic components and systems. This will support the competitiveness of industrial strongholds such as automotive, avionics, industrial automation, consumer electronics, telecoms and medical systems. In all these domains Europe’s leadership depends heavily on the capacity to engineer and produce electronic components and systems and to integrate these into products across all sectors. Furthermore, the social dimension is not to be underestimated given the increasingly important role of electronics in the functioning of modern society.

In addition to input received through various consultations with a large group of research stakeholders, research orientations under this Challenge are in line with the Strategic Research Agendas of European Technology Platforms ENIAC (on nanoelectronics), EPoSS (on systems integration), PHOTONICS21 (on photonics) and ARTEMIS (on embedded systems).

Research addressing this Challenge in particular will encourage international cooperation under the Intelligent Manufacturing Systems scheme.

This research will enable Europe’s industry to stay at the forefront of electronics developments and applications. As industry depends ever more on chip making and on embedded software, it is of strategic importance to maintain vibrant chip making and chip integrating functions in Europe as well as the related industries further down the electronics“food chain”. All these need early access to latest ICT. Intelligent functions embedded in components and systems will be a key factor in revolutionising many different applications in health, safety and security, transport, and provision of environmentally friendly sustainable applications, and many more. These will also greatly improve industrial production processes by adding intelligence to process control and the manufacturing shop

Objective ICT-2007.3.1: Next-Generation Nanoelectronics Components and Electronics [...]
Objective ICT-2007.3.2: Organic and large-area electronics, visualisation and display systems [...]
Objective ICT-2007.3.5: Photonic components and subsystems [...]
Objective ICT-2007.3.6: Micro/nanosystems [...]